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Scalable, Simple, and Versatile Encapsulation of 2D Materials and Devices
Air-sensitive 2D materials present fundamental challenges for device integration. Encapsulation is required to preserve intrinsic properties, yet conventional strategies demand complex fabrication workflows and fail for thicker flakes. We demonstrate that electron-beam (e-beam) evaporated aluminum oxide (AlOx) serves as an effective encapsulation layer and sacrificial fabrication mask, protecting sensitive flakes from air, photoresists, and chemicals.…
- Scalable, Simple, and Versatile Encapsulation of 2D Materials and Devices
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- Ken Burch named Rourke Professor of Physics